Plating thickness can be measured by the EDX.
There are two quantitative calculation methods, the calibration curve method and the thin-film FP method.
For multilayer-plating thickness measurements of screws or other materials, the thin-film FP method is suitable.
The following two points must be satisfied in order to perform plating thickness measurements.
(1)The number of layers, and the element information for each layer of the sample must be known.
(2)The surface must beflat and larger than the analysis diameter (collimator diameter).